西門子計(jì)劃將UltraSoC的技術(shù)集成到Xcelerator產(chǎn)品組合中，作為Mental Tessent軟件產(chǎn)品套件的一部分。

? 中華工控網(wǎng) 翻譯

注|為確保內(nèi)容的準(zhǔn)確性，本文附上英文對(duì)照

June 23, 2020 - Siemens has signed an agreement to acquire Cambridge, UK-based UltraSoC Technologies Ltd., a provider of instrumentation and analytics solutions that put intelligent monitoring, cybersecurity and functional safety capabilities into the core hardware of system-on-chip (SoC). Siemens plans to integrate UltraSoC’s technology into the Xcelerator portfolio as part of Mentor’s Tessent software product suite. The addition of UltraSoC to Siemens enables a unified data-driven infrastructure, and the creation of a solution to help semiconductor industry customers overcome key pain points including manufacturing defects, software and hardware bugs, device early-failure and wear-out, functional safety, and malicious attacks.

2020年6月23日——西門子已簽署協(xié)議收購(gòu)總部位于英國(guó)劍橋的UltraSoC Technologies公司，該公司提供儀器和分析解決方案，將智能監(jiān)控、網(wǎng)絡(luò)安全和功能安全能力納入片上系統(tǒng)(SoC)的核心硬件。西門子計(jì)劃將UltraSoC的技術(shù)集成到Xcelerator產(chǎn)品組合中，作為Mental Tessent軟件產(chǎn)品套件的一部分。將UltraSoC整合到西門子后，可以實(shí)現(xiàn)統(tǒng)一的數(shù)據(jù)驅(qū)動(dòng)基礎(chǔ)架構(gòu)，并創(chuàng)建一個(gè)解決方案來幫助半導(dǎo)體行業(yè)客戶克服關(guān)鍵難題，包括制造缺陷、軟件和硬件缺陷、設(shè)備早期故障和磨損、功能安全和惡意攻擊。

UltraSoC is a pioneer of embedding monitoring hardware into complex SoCs to enable “fab-to-field” analytics capabilities designed to accelerate silicon bring-up, optimize product performance, and confirm that devices are operating “as designed” for functional safety and cybersecurity purposes. Tessent is a specialist in SoC design-for-test (DFT) solutions, and has established strengths in the field of automotive functional safety via its Tessent Safety Ecosystem. These two offerings are the foundation of a complete package of solutions, encompassing semiconductor design and production, functional safety, cybersecurity, and functional optimization of products in the field.

UltraSoC是將監(jiān)控硬件嵌入復(fù)雜SoC中的先驅(qū)，可實(shí)現(xiàn)“晶圓廠到現(xiàn)場(chǎng)”分析功能，旨在加速芯片生產(chǎn)，優(yōu)化產(chǎn)品性能并確認(rèn)設(shè)備運(yùn)行符合功能安全和網(wǎng)絡(luò)安全的“設(shè)計(jì)”要求。Tessent是SoC測(cè)試設(shè)計(jì)（DFT）解決方案的專家，并通過其Tessent安全生態(tài)系統(tǒng)在汽車功能安全領(lǐng)域確立了優(yōu)勢(shì)。這兩個(gè)產(chǎn)品是整套解決方案的基礎(chǔ)，包括半導(dǎo)體設(shè)計(jì)和生產(chǎn)、功能安全、網(wǎng)絡(luò)安全和該領(lǐng)域產(chǎn)品的功能優(yōu)化。

The combination of Siemens and UltraSoC technology are intended to benefit the entire semiconductor product lifecycle, including structural, electrical, and functional capabilities of SoCs. It also supports Siemens’ comprehensive digital twin with UltraSoC providing monitoring of the real device.

西門子與UltraSoC技術(shù)的結(jié)合將使整個(gè)半導(dǎo)體產(chǎn)品生命周期受益，包括SoC的結(jié)構(gòu)、電氣和功能能力。它還通過UltraSoC支持西門子全面的數(shù)字孿生系統(tǒng)，從而提供對(duì)真實(shí)設(shè)備的監(jiān)控。

UltraSoC‘s products are used in the automotive, computing, storage and semiconductor industries. The company was recently selected as a participant in the DARPA AISS (Automatic Implementation of Secure Silicon) program; and is a member of the Secure-CAV consortium, an ambitious collaborative project that aims to improve the safety and security of tomorrow’s connected and autonomous vehicles (CAVs). Siemens’ acquisition of UltraSoC is due to close in the fourth quarter of Siemens’ fiscal year 2020. Terms of the transaction were not disclosed.

UltraSoC的產(chǎn)品用于汽車、計(jì)算、存儲(chǔ)和半導(dǎo)體行業(yè)。該公司最近被選為美國(guó)國(guó)防高級(jí)研究計(jì)劃局AISS(自動(dòng)實(shí)現(xiàn)安全硅)項(xiàng)目的參與者；并且是Secure-CAV聯(lián)盟的成員，該聯(lián)盟是一個(gè)雄心勃勃的合作項(xiàng)目，旨在提高未來聯(lián)網(wǎng)和自動(dòng)駕駛汽車（CAV）的安全性。西門子對(duì)UltraSoC的收購(gòu)將在西門子2020財(cái)年第四季度完成。交易具體條款沒有披露。